Fabrication of microstructured copper on an indium-tin-oxide surface using a micropatterned self-assembled monolayer as a template

被引：10

作者：

Asakura, S ^{[1
]}

Hirota, M ^{[1
]}

Fuwa, A ^{[1
]}

机构：

[1] Waseda Univ, Grad Sch Sci & Engn, Shinjuku Ku, Tokyo 1698555, Japan

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | 2003年 / 21卷 / 04期

关键词：

D O I：

10.1116/1.1584037

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The difference in chemical reactivity between indium-tin-oxide (ITO) and self-assembled monolayer (SAM) surfaces was used to fabricate copper (Cu) microstructures. ITO substrates coated with octadecyltrimethoxysilane (ODS)-SAM were photolithographically micropatterned using vacuum ultraviolet (VUV) light Each of the micropatterned samples was subsequently immersed in an electrodeposition bath in order to deposit Cu on its surface. As confirmed by atomic force microscopy, Cu electrodeposition proceeded selectively on the VUV-irradiated areas of the ITO surface while the ODS-SAM surface served effectively as a mask to block Cu deposition. Cu microstructures with 7.5 X 7.5 mum(2) features were successfully fabricated on the ITO surface. (C) 2003 American Vacuum Society.

引用

页码：1152 / 1156

页数：5

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