A practical microgripper by fine alignment, eutectic bonding and SMA actuation

被引：85

作者：

Lee, AP

Ciarlo, DR

Krulevitch, PA

Lehew, S

Trevino, J

Northrup, MA

机构：

[1] Lawrence Livermore Natl. Lab. (LLNL), Microtechnology Center, Livermore, CA 94551, PO Box 808

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1996年 / 54卷 / 1-3期

关键词：

microgrippers; silicon; shape memory alloys; selective eutectic bonding; remote gripping;

D O I：

10.1016/S0924-4247(97)80052-0

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A microgripper with a large gripping force, a relatively rigid structural body, and flexibility in functional design is presented. The actuation is generated by Ni-Ti-Cu shape memory alloy (SMA) films and the stress induced can deflect each side of the microgripper up to 55 mu m for a total gripping motion of 110 mu m. When fully open, the force exerted by the film corresponds to a 13 mN gripping force on the tip of the gripper.

引用

页码：755 / 759

页数：5

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