Meso scale pulsating jets for electronics cooling

被引:82
作者
Garg, J [1 ]
Arik, M
Weaver, S
Wetzel, T
Saddoughi, S
机构
[1] GE Global Res Ctr, Thermal Syst Lab, Niskayuna, NY 12309 USA
[2] GE Global Res Ctr, Micro & Nano Struct Technol Lab, Niskayuna, NY 12309 USA
[3] GE Global Res Ctr, Propuls Technol Lab, Niskayuna, NY 12309 USA
关键词
D O I
10.1115/1.2065727
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Microfluid devices are conventionally used for boundary layer control in many aerospace applications. Synthetic jets are intense small-scale turbulent jets formed from periodic entrainment and expulsion of the fluid in which they are embedded. The jets can be made to impinge upon electronic components thereby providing forced convection impingement cooling. The small size of these devices accompanied by the high exit air velocity provides an exciting opportunity to significantly reduce the size of thermal management hardware in electronics. A proprietary meso scale synthetic jet designed at GE Global Research is able to provide a maximum air velocity of 90 m/s from a 0.85 mm hydraulic diameter rectangular orifice. An experimental study for determining the cooling performance of synthetic jets was carried out by using a single jet to cool a thin foil heater The heat transfer augmentation caused by the jets depends on several parameters, such as, driving frequency, driving voltage, jet axial distance, heater size, and heat flux. During the experiments, the operating frequency for the jets was varied between 3.4 and 5.4 kHz, while the driving voltage was varied between 50 and 90 V-RMS. Two different heater powers, corresponding to approximately 50 and 80 degrees C, were tested. A square heater with a surface area of 156 mm 2 was used to mimic the hot component and detailed temperature measurements were obtained with a microscopic infrared thermal imaging technique. A maximum heat transfer enhancement of approximately 10 times over natural convection was measured. The maximum measured coefficient of performance was approximately 3.25 due to the low power consumption of the synthetic jets.
引用
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页码:503 / 511
页数:9
相关论文
共 13 条
[1]  
ACIKALIN T, 2002, THESIS PURDUE U IN
[2]  
CHIRIAC VA, 2003, INT INT EL PACK C HA
[3]  
GARG J, 2002, INT HEAT TRANSF C GR
[4]  
GILLESPIE MB, 1998, THESIS GEORGIA I TEC
[5]   Synthetic jets [J].
Glezer, A ;
Amitay, M .
ANNUAL REVIEW OF FLUID MECHANICS, 2002, 34 :503-529
[6]  
Incropera F. P., Introduction to Heat Transfer, Vfourth
[7]   Closed-loop electroosmotic microchannel cooling system for VLSI circuits [J].
Jiang, LN ;
Mikkelsen, J ;
Koo, JM ;
Huber, D ;
Yao, SH ;
Zhang, L ;
Zhou, P ;
Maveety, JG ;
Prasher, R ;
Santiago, JG ;
Kenny, TW ;
Goodson, KE .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2002, 25 (03) :347-355
[8]  
LEE TT, 1998, ELECT COOLING MAGAZI, V4, P30
[9]  
Minichiello A. L., 1997, Advances in Electronic Packaging 1997. Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference. INTERpack '97, P1809
[10]   DESCRIBING THE UNCERTAINTIES IN EXPERIMENTAL RESULTS [J].
MOFFAT, RJ .
EXPERIMENTAL THERMAL AND FLUID SCIENCE, 1988, 1 (01) :3-17