Potential-induced copper periodic micro-/nanostructures by electrodeposition on silicon substrate

被引：19

作者：

Zong, Zhaocun

Yu, Hai

Nui, Lianping

Zhang, Mingzhe ^{[1
]}

Wang, Chen

Li, Wei

Men, Yongfan

Yao, Binbin

Zou, Guangtian

机构：

[1] Jilin Univ, Natl Lab Superhard Mat, Changchun 130012, Peoples R China

来源：

NANOTECHNOLOGY | 2008年 / 19卷 / 31期

关键词：

D O I：

10.1088/0957-4484/19/31/315302

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

We demonstrate the fabrication of large scale nano- and micropatterned copper periodic structures on a silicon substrate without imposed templates. In the electrodeposition process, we employ a periodic variation voltage in an ultrathin layer of concentrated CuSO4 electrolyte. The pattern can be controlled by varying the frequency of the applied potential. We suggest that the observed periodic micro-/nanostructures are caused by the lag of the migrating ion concentration profile versus the applied voltage profile near the tip of the growth.

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页数：5

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