High voltage insulation performance of cryogenic liquids for superconducting power apparatus

被引:31
作者
Okubo, H
Hikita, M
Goshima, H
Sakakibara, H
Hayakawa, N
机构
[1] Nagoya University, Chikusa-ku, Nagoya 464-01, Furo-cho
关键词
D O I
10.1109/61.517498
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes high voltage insulation technology of cryogenic liquids for superconducting power apparatus. The insulation of a superconducting transformer is classified into several insulation components. Moreover, we investigate fundamental insulation characteristics peculiar to the superconducting and cryogenic circumstances: area and volume effects on breakdown strength, V-t characteristics, quench-induced dynamic breakdown characteristics and so on. Finally, we systematize the electrical insulation of cryogenic liquids, and propose the flow chart for the practical insulation design of superconducting power apparatus.
引用
收藏
页码:1400 / 1406
页数:7
相关论文
共 22 条
[1]  
BEGIN G, 1988, C EL APPL SUP
[2]  
Chu F. Y., 1988, World Congress on Superconductivity, P129
[3]  
COLETTI G, 1982, J ELECTROSTAT, V12, P297
[4]   DIELECTRIC BREAKDOWN OF GASEOUS HELIUM AT VERY LOW TEMPERATURES [J].
FALLOU, B ;
GALAND, J ;
BOUVIER, B .
CRYOGENICS, 1970, 10 (02) :142-&
[5]  
Forsyth E. B., 1990, IEEE Electrical Insulation Magazine, V6, P7, DOI 10.1109/57.63054
[6]  
Gerhold J., 1992, IEEE Electrical Insulation Magazine, V8, P14, DOI 10.1109/57.139067
[7]   GAP SIZE EFFECT ON LIQUID-HELIUM BREAKDOWN [J].
GERHOLD, J ;
HUBMANN, M ;
TELSER, E .
CRYOGENICS, 1994, 34 (07) :579-586
[8]  
GERHOLD J, 1993, 8TH P INT S HIGH VOL, P567
[9]   WEIBULL STATISTICAL-ANALYSIS OF AREA AND VOLUME EFFECTS ON THE BREAKDOWN STRENGTH IN LIQUID-NITROGEN [J].
GOSHIMA, H ;
HAYAKAWA, N ;
HIKITA, M ;
OKUBO, H ;
UCHIDA, K .
IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 1995, 2 (03) :385-393
[10]   DIELECTRIC-BREAKDOWN CHARACTERISTICS OF CRYOGENIC NITROGEN GAS ABOVE LIQUID-NITROGEN [J].
GOSHIMA, H ;
SUZUKI, T ;
HAYAKAWA, N ;
HIKITA, M ;
OKUBO, H .
IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 1994, 1 (03) :538-543