Numerical modelling of solder joint formation

被引：12

作者：

Bailey, C ^{[1
]}

Wheeler, D ^{[1
]}

Cross, M ^{[1
]}

机构：

[1] Univ Greenwich, Ctr Numer Modelling & Proc Anal, Greenwich, England

来源：

SOLDERING & SURFACE MOUNT TECHNOLOGY | 1998年 / 10卷 / 02期

关键词：

assembly; defects; numerical modelling; printed circuit boards; solder; solder joint;

D O I：

10.1108/09540919810219912

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Solder materials are used to provide a connection between electronic components and printed circuit boards (PCBs) using either the reflow or wave soldering process. As a board assembly passes through a reflow furnace the solder (initially in the form of solder paste) melts, reflows, then solidifies, and finally deforms between the chip and board. A number of defects may occur during this process such as flux entrapment, void formation, and cracking of the joint, chip or board, These defects are a serious concern to industry, especially with trends towards increasing component miniaturisation and smaller pitch sizes. This paper presents a modelling methodology for predicting solder joint shape, solidification, and deformation (stress) during the assembly process.

引用

页码：6 / +

页数：9

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