Optoelectronic interconnection technology in the HOLMS system

被引:23
作者
Lukowicz, P [1 ]
Jahns, J
Barbieri, R
Benabes, P
Bierhoff, T
Gauthier, A
Jarczynski, M
Russell, GA
Schrage, J
Süllau, W
Snowdon, JF
Wirz, M
Tröster, G
机构
[1] ETH, Elect Lab, CH-8805 Zurich, Switzerland
[2] Fern Univ Hagen, Opt Nachrichtentech, D-58084 Hagen, Germany
[3] Supelec, Serv Mesures, F-1192 Gif Sur Yvette, France
[4] Univ Gesamthsch Paderborn, D-33102 Paderborn, Germany
[5] Heriot Watt Univ, Edinburgh EH14 4AS, Midlothian, Scotland
[6] Siemens AG, D-33102 Paderborn, Germany
[7] ILFA Feinstleitertech GmbH, D-30559 Hannover, Germany
关键词
integrated optics; optical computing; optical interconnections; optoelectronic packaging; waveguide interconnections;
D O I
10.1109/JSTQE.2003.815492
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The High-Speed Optoelectronic Memory Systems (HOLMS) project, sponsored by the European Union Information Society Technology program, aims to make the use of board level optical interconnection in information systems practical and economical by developing optoelectronic packaging technology compatible with standard electronic assembly processes. To demonstrate the potential of the technology, it develops a demonstrator system that addresses the most pressing problem of contemporary computer architecture: memory latency. This paper describes the key ideas and some preliminary results of the HOLMS projects focusing on the electronic interconnection technology, in particular optoelectronic packaging issues.
引用
收藏
页码:624 / 635
页数:12
相关论文
共 51 条
[1]   Polymer fiber-image-guide-based embedded optical circuit board [J].
Ai, J ;
Li, Y .
APPLIED OPTICS, 1999, 38 (02) :325-332
[2]   Six-degrees-of-freedom alignment of two-dimensional arrays components by use of off-axis linear Fresnel zone plates [J].
Ayliffe, MH ;
Châteauneuf, M ;
Rolston, DR ;
Kirk, AG ;
Plant, DV .
APPLIED OPTICS, 2001, 40 (35) :6515-6526
[3]  
BARBIERI R, 2002, OPT MEMORY NEURAL NE, V4
[4]  
Brunfaut M, 2001, ECOC'01: 27TH EUROPEAN CONFERENCE ON OPTICAL COMMUNICATION, VOLS 1-6, P298, DOI 10.1109/ECOC.2001.989636
[5]   Fully embedded board-level guided-wave optoelectronic interconnects [J].
Chen, RT ;
Lin, L ;
Choi, C ;
Liu, YJJ ;
Bihari, B ;
Wu, L ;
Tang, SN ;
Wickman, R ;
Picor, B ;
Hibbs-Brenner, MK ;
Bristow, J ;
Liu, YS .
PROCEEDINGS OF THE IEEE, 2000, 88 (06) :780-793
[6]   Demonstration of a multichannel optical interconnection by use of imaging fiber bundles butt coupled to optoelectronic circuits [J].
Chiarulli, DM ;
Levitan, SP ;
Derr, P ;
Hofmann, R ;
Greiner, B ;
Robinson, M .
APPLIED OPTICS, 2000, 39 (05) :698-703
[7]  
CUPPU V, 2001, P 28 ANN S COMP ARCH
[8]  
Dal Cin M., 1994, Proceedings of the First International Conference on Massively Parallel Computing Systems (MPCS). The Challenges of General-Purpose and Special-Purpose Computing, P7, DOI 10.1109/MPCS.1994.367021
[9]  
FRIETMAN EEE, 1998, P MPPOI LAS VEG NV J
[10]  
GHOSE A, 1994, PARALLEL ARCHITECTUR