Microstructure evolution of electroless Ni-P and Ni-Cu-P deposits on Cu in the presence of additives

被引：23

作者：

Lin, KL ^{[1
]}

Chang, YL ^{[1
]}

Huang, CC ^{[1
]}

Li, FI ^{[1
]}

Hsu, JC ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 701, Taiwan

来源：

APPLIED SURFACE SCIENCE | 2001年 / 181卷 / 1-2期

关键词：

Ni-P; Ni-Cu-P; thiourea; saccharin;

D O I：

10.1016/S0169-4332(01)00387-7

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The microstructures of electroless Ni-P and Ni-Cu-P deposits were investigated in the presence of thiourea and saccharin with AFM. The phosphorus contents and crystallinity of the deposits were investigated. Saccharin was found to refine the nodular structure of the Ni-Cu-P deposit, while not affecting the P% of the Ni-P and Ni-Cu-P deposits. On the other hand, thiourea was found to affect the P% and surface roughness of the Ni-P deposit. Thiourea does not exhibit nodular refining effect on the deposit. (C) 2001 Elsevier Science B.V. All rights reserved.

引用

页码：166 / 172

页数：7