Novel high performance thermoelectric microcoolers with diamond substrates

被引：20

作者：

Semeniouk, V ^{[1
]}

Fleurial, JP ^{[1
]}

机构：

[1] Odessa State Acad Refrigerat, Thermion Co, Odessa, Ukraine

来源：

PROCEEDINGS ICT'97 - XVI INTERNATIONAL CONFERENCE ON THERMOELECTRICS | 1997年

关键词：

D O I：

10.1109/ICT.1997.667622

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

The concepts discussed in previous papers [1-3] have been implemented in novel miniature thermoelectric coolers (TECs) with diamond substrates. Micromodules with TE legs 0.2mm long and 0.4x0.4mm(2) in cross-section were developed. A maximum temperature difference of 67K was obtained, a value comparable to the ones obtained for commercial TECs with TE leg length of 1mm and higher. Heat flux densities of 70W/cm(2) at cold junctions were achieved. Taking into consideration the hot side thermal resistance, the minimum TE leg length was calculated. It was found that using high thermal conductivity substrates allows miniaturization of the TE legs near its lower theoretical limit defined by electrical contact resistance only. Cold side heat flux densities in excess of 100W/cm(2) can be attained in such coolers. This makes them ideal to solve thermal problem of high density localized heat sources such as power amplifiers, microprocessors and other power electronic devices which are already operating at the edge of their reliability.

引用

页码：683 / 686

页数：4