Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits

被引：82

作者：

Carchon, G ^{[1
]}

Vaesen, K

Brebels, S

De Raedt, W

Beyne, E

Nauwelaers, B

机构：

[1] IMEC, MCP HDIP Dept, B-3001 Heverlee, Belgium

[2] Katholieke Univ Leuven, ESAT TELEMIC Dept, Louvain, Belgium

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2001年 / 24卷 / 03期

关键词：

capacitor; coplanar waveguide; inductor; integrated passives; LNA; MCM-D; resistor; VCO;

D O I：

10.1109/6144.946500

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Thin-film multi-layer MCM-D technology using the system in a package concept is presented as a viable approach for the integration of high performance wireless front-end systems. Due to the high quality dielectrics and copper metallization, high quality transmission lines and inductors are available. This, together with the integrated passives design library containing scalable equivalent models for the inductors, capacitors, resistors, transmission lines and discontinuities, allows easy and accurate co-design between the passive and active devices. Examples of bandpass filters, power dividers, quadrature couplers, microwave feedthroughs, a DECT VCO and a 14 GHz LNA are given.

引用

页码：510 / 519

页数：10

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