机构:
Univ Calif Berkeley, Dept ME, Berkeley, CA 94720 USAUniv Calif Berkeley, Dept ME, Berkeley, CA 94720 USA
Cohn, MB
[1
]
Bohringer, KF
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h-index: 0
机构:
Univ Calif Berkeley, Dept ME, Berkeley, CA 94720 USAUniv Calif Berkeley, Dept ME, Berkeley, CA 94720 USA
Bohringer, KF
[1
]
Noworolski, JM
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h-index: 0
机构:
Univ Calif Berkeley, Dept ME, Berkeley, CA 94720 USAUniv Calif Berkeley, Dept ME, Berkeley, CA 94720 USA
Noworolski, JM
[1
]
Singh, A
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机构:
Univ Calif Berkeley, Dept ME, Berkeley, CA 94720 USAUniv Calif Berkeley, Dept ME, Berkeley, CA 94720 USA
Singh, A
[1
]
Keller, CG
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机构:
Univ Calif Berkeley, Dept ME, Berkeley, CA 94720 USAUniv Calif Berkeley, Dept ME, Berkeley, CA 94720 USA
Keller, CG
[1
]
Goldberg, KY
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机构:
Univ Calif Berkeley, Dept ME, Berkeley, CA 94720 USAUniv Calif Berkeley, Dept ME, Berkeley, CA 94720 USA
Goldberg, KY
[1
]
Howe, RT
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机构:
Univ Calif Berkeley, Dept ME, Berkeley, CA 94720 USAUniv Calif Berkeley, Dept ME, Berkeley, CA 94720 USA
Howe, RT
[1
]
机构:
[1] Univ Calif Berkeley, Dept ME, Berkeley, CA 94720 USA
来源:
MICROFLUIDIC DEVICES AND SYSTEMS
|
1998年
/
3515卷
关键词:
MEMS;
microassembly;
serial assembly;
parallel assembly;
self-assembly;
wafer-to-wafer transfer;
packaging;
D O I:
10.1117/12.322082
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
Microassembly promises to extend MEMS beyond the confines of silicon micromachining. This paper surveys research in both serial and parallel microassembly. The former extends conventional "pick and place" assembly into the micro-domain, where surface forces play a dominant role. Parallel assembly involves the simultaneous precise organization of an ensemble of micro components. This can be achieved by microstructure transfer between aligned wafers or arrays of binding sites that trap an initially random collection of parts. Binding sites can be micromachined cavities or electrostatic traps; short-range attractive forces and random agitation of the parts serve to fill the sites. Microassembly strategies should furnish reliable mechanical bonds and electrical interconnection between the micropart and the target substrate or subassembly.