Design of mixed-signal systems-on-a-chip

被引:88
作者
Kundert, K [1 ]
Chang, H
Jefferies, D
Lamant, G
Malavasi, E
Sendig, F
机构
[1] Cadence Design Syst 3, San Jose, CA 95134 USA
[2] Cadence Design Syst, Tokyo, Japan
[3] Cadence Design Syst, Columbia, MD 21046 USA
关键词
design automation; design methodology; hardware design languages; integrated circuit layout; integrated circuit modeling; mixed analog digital integrated circuits; simulation; testing;
D O I
10.1109/43.898832
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
The electronics industry is increasingly focused on the consumer marketplace, which requires low-cost high-volume products to be developed very rapidly. This, combined with advances in deep submicrometer technology have resulted in the ability and the need to put entire systems on a single chip. As more of the system is included on a single chip, it is increasingly likely that the chip will contain both analog and digital sections. Developing these mixed-signal (MS) systems-on-chip presents enormous challenges both to the designers of the chips and to the developers of the computer-adided design (CAD) systems that are used during the design process. This paper presents many of the issues that act to complicate the development of large single chip MS systems and how CAD systems are expected to develop to overcome these issues.
引用
收藏
页码:1561 / 1571
页数:11
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