Fabrication of piezoelectric acoustic transducers built on cantilever-like diaphragm

被引:10
作者
Han, CH [1 ]
Kim, ES [1 ]
机构
[1] Univ Hawaii Manoa, Dept Elect Engn, Honolulu, HI 96822 USA
来源
14TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2001年
关键词
D O I
10.1109/MEMSYS.2001.906491
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The paper presents a technique to fabricate a cantilever like diaphragm that releases the residual stress (and also is mechanically flexible) much like a cantilever, and yet is itself a diaphragm with its four edges cramped. Using the high mechanical flexibility (i.e., extremely low Youngs Modulus) of parylene as a holding layer, we have successfully fabricated various piezoelectric acoustic transducers built on silicon nitride layer (either in cantilever form and/or freely-suspended island form) with electrodes and piezoelectric ZnO film. Since parylene has relatively low melting point (around 280 degreesC for parylene C), we deposit the parylene holding layer toward the end of the fabrication process after processing all the high temperature steps. Then after releasing the diaphragm with KOH etching, the silicon nitride is patterned from the backside with a reactive ion etcher (RIE). To demonstrate the effectiveness of a parylene-held cantilever-like diaphragm in releasing the residual stress, the devices before and after patterning the silicon nitride are compared. The acoustic outputs of the fabricated transducers have been measured with B&K 4135 microphone.
引用
收藏
页码:110 / 113
页数:2
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