Off-line control of time-pressure dispensing processes for electronics packaging

被引:42
作者
Chen, XB [1 ]
Zhang, WJ
Schoenau, G
Surgenor, B
机构
[1] Univ Saskatchewan, Dept Mech Engn, Saskatoon, SK S7N 5A9, Canada
[2] Queens Univ, Dept Mech Engn, Kingston, ON K7N 3N6, Canada
来源
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING | 2003年 / 26卷 / 04期
基金
加拿大自然科学与工程研究理事会;
关键词
electronics packaging; model updating; off-line control; time-dependent fluid behavior; time-pressure dispensing;
D O I
10.1109/TEPM.2003.820824
中图分类号
T [工业技术];
学科分类号
08 [工学];
摘要
Fluid dispensing is one critical process in electronics packaging, in which fluid materials (such as encapsulant, adhesive) are delivered controllably onto substrates for the purpose of encapsulation. Time-pressure dispensing is recently the most widely used approach, and its control has proven to be a challenging task due to the fact that the dispensing process performance is significantly affected by the behavior of the fluid dispensed. Moreover, if the fluid exhibits time-dependent behavior, the control becomes more difficult and demanding. This paper presents it method to model the time-pressure dispensing process, taking into account the time-dependent fluid behavior. Based on the model developed, an off-line control strategy is developed for improving the process performance. Experiments on a typical commercial dispensing system were carried out to verify the effectiveness of the modeling method and the off-line control strategy.
引用
收藏
页码:286 / 293
页数:8
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