Encapsulation of phase change material by means of electroplating

被引：6

作者：

Akiyama, T ^{[1
]}

Yagi, J

Watanabe, Y

Miura, S

机构：

[1] Tohoku Univ, Inst Adv Mat Proc, Sendai, Miyagi 98077, Japan

[2] KEDC Corp, Sendai, Miyagi 982, Japan

来源：

KAGAKU KOGAKU RONBUNSHU | 1997年 / 23卷 / 04期

关键词：

heat transfer; phase change material; metallic capsule; electroplating;

D O I：

10.1252/kakoronbunshu.23.591

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

Encapsulation of a phase-change material (PCM) based on electroplating method is investigated experimentally. The encapsulated PCM has a two-layer structure, which is coated thinly by metallic nickel and rhodium. The PCM obtained has enough strength against melting-solidification cycles when the thickness of nicker is more than 50 microns. The present method offers many benefits for the practical use of PCM, such as uniform film thickness, easy and quick coating and non-sintering among capsules.

引用

页码：591 / 593

页数：3

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