Structure, chain orientation, and properties in thin films of aromatic polyimides with various chain rigidities

被引:179
作者
Ree, M
Kim, K
Woo, SH
Chang, H
机构
[1] Department of Chemistry, Pohang Univ. of Sci. and Technology, Pohang, Kyongbuk 790-784
关键词
D O I
10.1063/1.364210
中图分类号
O59 [应用物理学];
学科分类号
摘要
Several high temperature polyimides, as model polymers with various chain rigidities and chain orders, were synthesized through the polycondensation of p-phenylene diamine (PDA) with five different aromatic dianhydrides [i.e., pyromellitic dianhydride (PMDA), biphenyltetracarboxylic dianhydride (BPDA), 4,4'-oxydiphthalic anhydride (ODPA), benzophenonetetracarboxylic dianhydride (BTDA), and 4,4'-hexafluoroisopropylidenediphthalic anhydride (6F)], and investigated in terms of structure and properties. Both fully rodlike PMDA-PDA and ether-linked ODPA-PDA polyimides showed excellent orientation and poor ordering of chain in x-ray diffraction patterns, whereas both biphenyl-linked (BPDA-PDA) and carbonyl-linked (BTDA-PDA) polyimides exhibited excellent orientation and high ordering of chain. However, hexafluoroisopropylidene-linked 6F-PDA polyimide is structureless. The coherence length along the chain axis, which is a measure of chain rigidity and ordering, was estimated from (00l) peaks of x-ray diffraction patters: 6F-PDA (could not be measured) <ODPA-PDA (95 Angstrom)<BTDA-PDA (98 Angstrom)<BPDA-PDA (104 Angstrom)<PMDA-PDA (130 Angstrom). in films prepared on substrates, all polyimides were preferentially oriented in the film plane. However, the degree of molecular in-plane orientation strongly depended on the coherence length. Higher coherence length, i.e., higher chain rigidity and ordering, caused higher in-plane orientation of chains. However, the chain rigidity is more critically responsible for molecular in-plane orientation, in comparison to the chain ordering. Higher in-plane orientation of chains led to larger anisotropies of refractive indices and dielectric constants, higher in-plane modulus, lower in-plane thermal expansion coefficient, and lower residual stress. (C) 1997 American Institute of Physics.
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页码:698 / 708
页数:11
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