High strength-ductility of thin nanocrystalline palladium films with nanoscale twins: On-chip testing and grain aggregate model

被引：53

作者：

Colla, M. -S. ^{[1
,2
]}

Wang, B. ^{[3
]}

Idrissi, H. ^{[3
]}

Schryvers, D. ^{[3
]}

Raskin, J. -P. ^{[2
,4
]}

Pardoen, T. ^{[1
,2
]}

机构：

[1] Catholic Univ Louvain, Inst Mech Mat & Civil Engn, B-1348 Louvain, Belgium

[2] Catholic Univ Louvain, Res Ctr Micro & Nanoscop Mat & Elect Devices, B-1348 Louvain, Belgium

[3] Univ Antwerp, Dept Phys, EMAT, B-2020 Antwerp, Belgium

[4] Catholic Univ Louvain, ICTEAM, B-1348 Louvain, Belgium

来源：

ACTA MATERIALIA | 2012年 / 60卷 / 04期

关键词：

Nanocrystalline film; Twinning; Tensile testing; Strengthening mechanism; Analytical modelling; STRAIN-RATE SENSITIVITY; CRYSTAL PLASTICITY; MAXIMUM STRENGTH; STRESS; ALUMINUM; METALS; DEFORMATION; BEHAVIOR; COPPER; CU;

D O I：

10.1016/j.actamat.2011.11.054

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The mechanical behaviour of thin nanocrystalline palladium films with an similar to 30 nm in plane grain size has been characterized on chip under uniaxial tension. The films exhibit a large strain hardening capacity and a significant increase in the strength with decreasing thickness. Transmission electron microscopy has revealed the presence of a moderate density of growth nanotwins interacting with dislocations. A semi-analytical grain aggregate model is proposed to investigate the impact of different contributions to the flow behaviour, involving the effect of twins, of grain size and of the presence of a thin surface layer. This model provides guidelines to optimizing the strength/ductility ratio of the films. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：1795 / 1806

页数：12

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