Adhesion between PMMA mask layer and silicon wafer in KOH aqueous solution

被引：11

作者：

Ilie, M ^{[1
]}

Marculescu, B ^{[1
]}

Moldovan, N ^{[1
]}

Nastase, N ^{[1
]}

Olteanu, M ^{[1
]}

机构：

[1] Natl Inst Res & Dev Microtechnol, IMT, Bucharest 72996, Romania

来源：

MATERIALS AND DEVICE CHARACTERIZATION IN MICROMACHINING | 1998年 / 3512卷

关键词：

PMMA; silicon; KOH; work of adhesion; surface energy; interfacial tension; superficial tension; contact angle;

D O I：

10.1117/12.324086

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The adhesion of PMMA layers on silicon wafer has been studied in order to protect the front side of the silicon wafer while etching the backside in KOH aqueous solution. Pre and post-bake treatment have been performed, different primers have been used to optimise the superficial and interfacial tension of both mask layer and substrate. An adherent layer has been obtained and its behaviour has been explained based on the polar and nonpolar interactions across the interface.

引用

页码：422 / 430

页数：9