Preparation and electrical resistance characteristics of electroless copper-nickel alloy deposits

被引：14

作者：

Nawafune, H ^{[1
]}

Uegaki, T

Mizumoto, S

Ishikawa, M

Nakamura, T

机构：

[1] Konan Univ, Fac Sci, Higashinada Ku, Okamoto, Kobe 658, Japan

[2] Osaka Municipal Tech Res Inst, Joto Ku, Morinomiya, Osaka 536, Japan

[3] Matsushita Ekect Component Co Ltd, Kadoma, Osaka 571, Japan

来源：

TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING | 1998年 / 76卷

关键词：

electroless deposition; copper-nickel-alloy; copper-nickel-phosphorus alloy; specific resistance; TCR (temperature coefficient of resistance);

D O I：

10.1080/00202967.1998.11871231

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Studies have been made of art electroless copper-nickel-phosphorus alloy from a citrate complex bath using hypophosphite as reducing agent and electroless copper-nickel binary alloy from a triethanolamine complex bath using formaldehyde as reducing agent With an increase in copper content of alloy, the specific resistance of deposit decreased The TCR of copper-nickel-phosphorus alloy increased remarkably because of the crystallization of Ni3P after hear treatment. But the increase in TCR of copper-nickel binary alloy was moderate and not so striking as for the phosphorus containing alloy.

引用

页码：231 / 234

页数：4