Quantitative analysis of modularization in the automobile and PC industries

被引:7
作者
Genba, K
Ogawa, H
Kodama, F
机构
[1] Univ Tokyo, Dept Engn, Tokyo, Japan
[2] Univ Tokyo, Res Ctr Adv Econ Engn, Tokyo, Japan
关键词
D O I
10.1080/09537320500089110
中图分类号
C93 [管理学];
学科分类号
12 ; 1201 ; 1202 ; 120202 ;
摘要
Much research has been done on modularizing the PC industry and automobile industry. In the analysis of the effect of modularization in the PC and automobile industries, however, very little of this research has been quantitative. In this paper, we use the number of patent applications for PC and automobile components to analyze the modularization in the PC and automobile industry. We calculated a ratio of the number of patents applied for by PC/automobile manufacturers vis-a-vis the total number of patent applications for the components, and used it to quantitatively judge whether PC/automobile manufacturers still hold the initiative with respect to R&D. The analysis indicates that PC manufacturers no longer hold the R&D initiative but that automobile manufacturers still do for engine control systems. On the other hand, it indicates that automobile manufacturers no longer hold the R&D initiative on the safety and communication control systems. The paper finally verifies the correlation between modularization and R&D initiative by means of regression analysis.
引用
收藏
页码:231 / 245
页数:15
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