Analysis and performance of BGA interconnects for RF packaging

被引：8

作者：

Staiculescu, D ^{[1
]}

Pham, A ^{[1
]}

Laskar, J ^{[1
]}

Consolazio, S ^{[1
]}

Moghe, S ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Packaging Res Ctr, Atlanta, GA 30332 USA

来源：

1998 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM | 1998年

关键词：

D O I：

10.1109/RFIC.1998.682064

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We present the development of a lumped element model for the EGA transition using both measurements and simulations results. Measurements of the test structure are used to generate a circuit model for a single bump configuration. This model is used to calibrate EM simulations of the bump geometry. Furthermore, the effect of the bump diameter on the equivalent circuit model is presented. This model approach is scaleable and extendible to a more global behavior of EGA interconnects for RF packaging.

引用

页码：131 / 134

页数：4