Lapping of single crystal diamond tools

被引:53
作者
Yuan, ZJ [1 ]
Yao, YX [1 ]
Zhou, M [1 ]
Bai, QS [1 ]
机构
[1] Harbin Inst Technol, Dept Mech Engn, Harbin 150006, Peoples R China
关键词
diamond; lapping; crystal plane;
D O I
10.1016/S0007-8506(07)60585-X
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Lapping is the key technology used in manufacturing process of diamond tools and diamond jewels. Because of the strong anisotropism and super hardness of diamond, the material removal rate is very small in its lapping process. The influence of the crystal anisotropism on removal rate in diamond lapping is discussed in this paper. A new diamond crystal orientation method by using laser diffraction is presented, which can not only be used for the crystal orientation, but also for the indication of 'soft' directions on crystal planes in lapping. The mechanism of removal rate anisotropism in diamond lapping is investigated, and a new explanation for the reasons is proposed. It is pointed out that the variation of inclination angle between inside (111) plane (cleavage plane) and lapping surface causes the difference of friction coefficient and removal rate in diamond lapping. Furthermore, a new method using ultrasonic vibration for diamond lapping was developed to improve the removal rate.
引用
收藏
页码:285 / 288
页数:4
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