Microtechnology in the development of three-dimensional circuits

被引：43

作者：

Herrick, KJ ^{[1
]}

Yook, JG ^{[1
]}

Katehi, LPB ^{[1
]}

机构：

[1] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 1998年 / 46卷 / 11期

关键词：

coplanar waveguide; micromachining; microstrip; MMIC;

D O I：

10.1109/22.734496

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

With today's cost-conscience industry, low-cost, high-performance, and high-profit microwave-circuit technologies are essential. To increase density and reduce size and cost, the integration of analog and digital circuits on one single chip is considered the most viable solution. In reducing the size of the overall system, high-density integration (HDI) and packaging have become critical components in circuit design. This paper reviews and evaluates state-of-the-art planar transmission lines and vertical interconnects for use in high-density multilayer circuits for silicon- and SiGe-based monolithic high-frequency circuits. Packaging issues associated with parasitics will be discussed and examples of multilayer three-dimensional systems utilizing micromachining will be presented.

引用

页码：1832 / 1844

页数：13

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