Model of interfacial thermal resistance of diamond composites

被引：17

作者：

Jagannadham, K ^{[1
]}

机构：

[1] N Carolina State Univ, Dept Mat Sci & Engn, Raleigh, NC 27695 USA

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | 1999年 / 17卷 / 02期

关键词：

D O I：

10.1116/1.581597

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The effective thermal conductivity of diamond and aluminum nitride layered composites was analyzed for three different types of interfaces. A sharp interface with a stepwise discontinuity, a graded interface with a linear variation and a diffused interface with a minimum or a maximum in thermal conductivity across the interface were considered. The results of the modeling analysis were used to explain the experimental results described in the literature of improved heat spreader characteristics of diamond and aluminum nitride composites. (C) 1999 American Vacuum Society. [S0734-2101(99)02502-6].

引用

页码：373 / 379

页数：7

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