Effect of aggregation and interfacial thermal resistance on thermal conductivity of nanocomposites and colloidal nanofluids

被引：405

作者：

Evans, William ^{[2
,3
]}

Prasher, Ravi ^{[4
]}

Fish, Jacob ^{[3
]}

Meakin, Paul ^{[5
]}

Phelan, Patrick ^{[6
]}

Keblinski, Pawel ^{[1
]}

机构：

[1] Rensselaer Polytech Inst, Dept Mat Sci & Engn, Troy, NY 12180 USA

[2] Lockheed Martin Corp, Niskayuna, NY 12301 USA

[3] Rensselaer Polytech Inst, Dept Mech Engn, Troy, NY 12180 USA

[4] Intel Corp, Chandler, AZ 85226 USA

[5] Idaho Natl Lab, Ctr Adv Modelling & Simulat, Idaho Falls, ID 83415 USA

[6] Arizona State Univ, Dept Mech & Aerosp Engn, Tempe, AZ 85287 USA

来源：

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | 2008年 / 51卷 / 5-6期

关键词：

nanoparticles; aggregation; thermal conductivity; interfacial thermal resistance; homogenization model; Monte Carlo simulation;

D O I：

10.1016/j.ijheatmasstransfer.2007.10.017

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

We analyzed the role of aggregation and interfacial thermal resistance on the effective thermal conductivity of nanofluids and nanocomposites. We found that the thermal conductivity of nanofluids and nanocomposites can be significantly enhanced by the aggregation of nanoparticles into clusters. The value of the thermal conductivity enhancement is determined by the cluster morphology, filler conductivity and interfacial thermal resistance. We also compared thermal conductivity enhancement due to aggregation with that associated with high-aspect ratio fillers, including fibers and plates. (C) 2007 Elsevier Ltd. All rights reserved.

引用

页码：1431 / 1438

页数：8

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