Challenges in the packaging of MEMS

被引：52

作者：

O'Neal, CB ^{[1
]}

Malshe, AP ^{[1
]}

Singh, SB ^{[1
]}

Brown, WD ^{[1
]}

Eaton, WP ^{[1
]}

机构：

[1] Univ Arkansas, High Dens Elect Ctr, Fayetteville, AR 72701 USA

来源：

INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS | 1999年

关键词：

D O I：

10.1109/ISAPM.1999.757284

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：41 / 47

页数：5

共 14 条

[1]

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[2]

BROWN WD, 1999, ADV ELECT PACKAGING, P3

[3]

Butler JT, 1997, TRANSDUCERS 97 - 1997 INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, P261, DOI 10.1109/SENSOR.1997.613633

[4]

CHANDRAN BI, 1996, DETERMINATION UTILIZ

[5]

CHIEN IY, 1995, ELECTRON ENG, P41

[6] Electrostatic combdrive-actuated micromirrors for laser-beam scanning and positioning [J].

Kiang, MH ;

Solgaard, O ;

Lau, KY ;

Muller, RS .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1998, 7 (01) :27-37

[7]

Kloeck B., 1994, SEMICONDUCTOR SENSOR, P153

[8]

Kniffin M. L., 1996, International Journal of Microcircuits and Electronic Packaging, V19, P75

[9]

LYKE J, PACKAGING TECHNOLOGI, P133

[10]

MONK DJ, 1996, P 1996 SENS EXP, P275

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