Polyimide-side-chain tethered polyhedral oligomeric silsesquioxane nanocomposites for low-dielectric film applications

Low-dielectric-constant nanoporous films (dielectric constant, k = 2.4) with thermal integrity and controllable mechanical strength have been prepared by covalently tethering nanoporous polyhedral oligomeric silsesquioxane (POSS) molecules, 1-nm size, to the side chains of polyimide. The tethered POSS molecules in the amorphous polyimide retain a nanoporous crystal structure, but form an additional ordered architecture due to microphase separation. With this approach, the dielectric constant of the film can be tuned by the amount of POSS molecules introduced in the nanocomposite film; the polyimide molecules offer additional advantages of maintaining certain thermal and mechanical strengths.