Cross-sectional imaging of semiconductor device structures by scanning resistance microscopy

被引:25
作者
Nxumalo, JN
Shimizu, DT
Thomson, DJ
机构
[1] Dept. of Elec. and Comp. Engineering, University of Manitoba, Winnipeg
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1996年 / 14卷 / 01期
关键词
D O I
10.1116/1.588479
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Scanning resistance microscopy (SRM) is a scanning probe microscopy technique that performs localized contact resistance profiling over a semiconductor surface. Experimental results show that this technique can localize p-n junctions with a lateral spatial resolution of less than 35 nm. Here we present results from SRM imaging of a metal-oxide-semiconductor field-effect transistor and silicon on insulator cross sections. These results were obtained with a constant current SRM imaging technique. We also show that doped diamond tips can overcome some wear and resolution problems observed with metal tips. (C) 1996 American Vacuum Society.
引用
收藏
页码:386 / 389
页数:4
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