Reliability evaluation of chip-on-flex CSP devices

被引：4

作者：

Fillion, R ^{[1
]}

Burdick, B ^{[1
]}

Piacente, P ^{[1
]}

Douglas, L ^{[1
]}

Shaddock, D ^{[1
]}

机构：

[1] GE, Ctr Corp Res & Dev, Schenectady, NY 12301 USA

来源：

1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS | 1998年

关键词：

chip scale packaging; EGA; Chip-on-Flex; mini-BGA;

D O I：

10.1109/ICMCM.1998.670787

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

The GE/Lockheed Martin developed Chip-on-Flex (COF) multichip module (MCM) technology was developed to address high volume commercial applications where cost, as well as size, are critical design requirements. Single chip versions of the COF MCM process evolved as a workaround for those applications that had riot solved the Known-Good-Die (KGD) cost and availability issues. This paper will describe the design, fabrication, assembly, and evaluation of a COF CSP device with a number of design options. The evaluation includes thin and thick under-bump metallization, mask defined and non-masked defined I/O pads, and I/O pads located within, near, and beyond the perimeter of the chip over the plastic encapsulation. The devices will be assembled onto a PWB with mini-BGA solder balls stencil printed onto the CSP devices. Both underfilled and non-underfilled assembly will be evaluated. The environmental testing will focus on thermal cycling to induce solder fatigue. The objective of this effort is to quantify the life cycle predictions for various COF CSP configurations, under different environmental conditions.

引用

页码：242 / 246

页数：5