3D-CSP, an innovative packaging methods based on RMPD

被引：3

作者：

Bohlmann, H ^{[1
]}

Götzen, R ^{[1
]}

Reinhardt, A ^{[1
]}

机构：

[1] MicroTEC Gesell Mikrotechnol MbH, D-47057 Duisburg, Germany

来源：

MEMS DESIGN, FABRICATION, CHARACTERIZATION, AND PACKAGING | 2001年 / 4407卷

关键词：

RMPD; microsystems; Chip Size Packaging; 3D-CSP;

D O I：

10.1117/12.425300

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A major bottleneck in the applications of Microtechnlogies are packaging and interconnection techniques. 3D-CSP (3D-Chip-Size-Packaging), which is based on RMPD (R), solves an extremely wide range of packaging problems. RMPD (R) and 3D-CSP are discussed and applications presented.

引用

页码：180 / 184

页数：5