Use of compliant adhesives in the large area processing of MCM-D substrates

被引：4

作者：

Sitaraman, SK ^{[1
]}

Sundararaman, V ^{[1
]}

Manjula, S ^{[1
]}

Wong, CP ^{[1
]}

Wu, J ^{[1
]}

Pike, RT ^{[1
]}

机构：

[1] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Packaging Res Ctr, Atlanta, GA 30332 USA

来源：

48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS | 1998年

关键词：

D O I：

10.1109/ECTC.1998.678814

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Large area processing of substrates results in cost and time reduction in the fabrication of MCM-D structures. The present study focuses on the adhesive attachment of alumina and silicon tiles to suitable pallets to facilitate large area thin film processing of MCM structures. Parametric numerical:al models of the attachment of tiles on pallet have been developed to conduct "what-if" type analyses to understand the effects of various geometry and material parameters on thermo-mechanical response. Results from this study show that the use of low modulus, highly compliant adhesives significantly lowers the out-of-plane warpage and thermomechanical stresses in the structures. A novel set of adhesives has been developed that specifically meet the other stringent requirements, in terms of required adhesion, thermal stability and reworkability, for the palletization task.

引用

页码：895 / 899

页数：5