Microstructural characterization of Pt/Ti and RuO2 electrodes on SiO2/Si annealed in the oxygen ambient

被引:6
作者
Lee, JS
Kwon, HJ
Jeong, YW
Kim, HH
Park, KH
Kim, CY
机构
来源
FERROELECTRIC THIN FILMS V | 1996年 / 433卷
关键词
D O I
10.1557/PROC-433-175
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Microstructures and interdiffusions of Pt/Ti/SiO2/Si and RuO2/SiO2/Si during annealing in O-2 were investigated using x-ray diffraction, Auger electron spectroscopy, scanning electron microscopy, and transmission electron microscopy. The degree of oxidation and the interdiffusion of elements have remarkably increased with increasing temperature above 500 degrees C for the Pt/Ti/SiO2/Si case. The generation of Pt hillocks commenced at 500 degrees C. The Pt-silicide phase was also observed near the TiOx/SiO2 interface. The microstructural variations occurred to only a small amount for the RuO2/SiO2/Si case over the temperature range 300-700 degrees C. While there was no hillock formation, the RuO2 film surface was roughened by the thermal grooving phenomenon. A thin interlayer phase was found at the RuO2/SiO2 interface.
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页码:175 / 180
页数:6
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