Effects of micro-additions on structures and properties of rapidly solidified Sn-10% Sb alloy

Structure, electrical resistivity, hardness, internal friction and elastic modulus of Sn-10% Sb and Sn89Sb10M1 (M-1 = Ag, Cu, Zn and Pb) alloys have been investigated. No obvious change on the electrical resistivity value was found at 293degreesK of a Sn-10% Sb alloy by adding Zn and Cu, but extreme changes occurred after adding Ag and Pb. The elastic modulus, internal friction, hardness and thermal diffusivity values are greatly affected by adding the micro-additions to a Sn-10% Sb rapidly solidified alloy. It is also interesting to note that Ledbetter's theoretical values of mu/E are in good agreement with the experimental results. The rapidly solidified alloys Sn90Sb10 and Sn89Sb10Ag1 have good properties as toxic-free lead solder alloys for high-temperature applications and good mechanical properties such as under the hood in the automobile and avionics systems. Also, the rapidly solidified alloys Sn89Sb10Zn1, Sn89Sb10Cu1 and Sn89Sb10Pb1 have good properties as bearing materials.