Binder system for micropowder injection molding

被引：103

作者：

Liu, ZY

Loh, NH

Tor, SB

Khor, KA

Murakoshi, Y

Maeda, R

机构：

[1] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore

[2] Mech Engn Lab, Tsukuba, Ibaraki 3058564, Japan

来源：

MATERIALS LETTERS | 2001年 / 48卷 / 01期

关键词：

powder injection molding; micropowder injection molding; binder system; stainless steel;

D O I：

10.1016/S0167-577X(00)00276-7

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

To exploit the potential of microsystem technology, micropowder injection molding (mu PIM), an economical mass production technology of microparts, is currently being investigated. Present work focused on establishing a suitable binder system for mu PIM. Multicomponent binder systems, comprising of different weight percentages of Paraffin Wax (PW), Ethylene Vinyl Acetate (EVA) and High Density Polyethylene (HDPE) were investigated. The findings indicate that 316L stainless steel microparts in dimensions of 100 x 100 x 250 mum can be molded, debound and sintered successfully using a 20 wt.% PW + 40 wt.% EVA + 40 wt.% HDPE binder system. (C) 2001 Elsevier Science B.V. All rights reserved.

引用

页码：31 / 38

页数：8

共 12 条

[1] INJECTION-MOLDING OF 316L STAINLESS-STEEL POWDER USING NOVEL BINDER SYSTEM [J].