Theoretical and experimental analysis on the thickness-controlled residual stress during drying of solvent-absorbed polymer films

被引：5

作者：

Park, KS

Kwon, YD

Kim, D ^{[1
]}

机构：

[1] Sungkyunkwan Univ, Dept Chem Engn, Suwon 440746, Kyunggy, South Korea

[2] Sungkyunkwan Univ, Polymer Technol Inst, Suwon 440746, Kyunggy, South Korea

[3] Sungkyunkwan Univ, Dept Text Engn, Suwon 440746, Kyunggy, South Korea

来源：

POLYMER JOURNAL | 2001年 / 33卷 / 07期

关键词：

diffusion; residual stress; drying process; polymer films; modulus;

D O I：

10.1295/polymj.33.503

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

Thickness-controlled residual stress was experimentally measured during drying of polyimide films using interferometer and bending beam systems. The local solvent concentration and temperature inside films were theoretically predicted using Fick's diffusion and Fourier's heat transfer equations. Introduction of bending moment theory made it possible to develop equations relating the residual stress with solvent concentration in films. The experimental stress behavior was in good agreement with the theoretical one, and the modulus of polyimide/NMP systems was determined from the best fit of two results.

引用

页码：503 / 508

页数：6

共 17 条

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[3]

Coburn J.C., 1996, Polyimides: Fundamentals and Applications, P207

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