Characterization of underfill/passivation interfacial adhesion for direct chip attach assemblies using fracture toughness and hydro-thermal fatigue measurements

被引：15

作者：

Gurumurthy, CK ^{[1
]}

Norris, LG ^{[1
]}

Hui, CY ^{[1
]}

Kramer, EJ ^{[1
]}

机构：

[1] Cornell Univ, Dept Mat Sci & Engn, Ithaca, NY 14853 USA

来源：

48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS | 1998年

关键词：

D O I：

10.1109/ECTC.1998.678778

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Delamination of underfill/passivation interface is a major cause for failure of direct chip attach (DCA) assemblies during reliability testing. We have used a modified asymmetric double cantilever beam (ADCB) testing for measuring the fracture toughness of the interface and a newly developed hydro-thermal fatigue testing (based on non-contact fiber optic displacement sensor) for measuring the fatigue crack growth rate along the interface. We have developed and used a simple anhydride cured model underfill epoxy (that captures the basic chemistry of the underfills) and a commercially available PMDA/ODA passivation for this study. Both the fracture toughness (determined through ADCB testing) and the fatigue crack growth rate (determined through hydro-thermal fatigue testing) are dependent on the mechanical phase angle under which the crack grows.

引用

页码：721 / 728

页数：8