Effect of nano-sized silver particles on the resistivity of polymeric conductive adhesives

被引:225
作者
Lee, HH
Chou, KS [1 ]
Shih, ZW
机构
[1] Natl Tsing Hua Univ, Dept Chem Engn, Hsinchu 30013, Taiwan
[2] Chung Shan Inst Sci & Technol, Tao Yuan 325, Taiwan
关键词
nano-sized silver colloid; micro-sized silver flake; conductive adhesive;
D O I
10.1016/j.ijadhadh.2004.11.008
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
In this work. conductive adhesives were made by adding micro-sized silver flakes, mixed-sized silver particles or nano-sized silver colloids to the polyvinyl acetate (PVAc) emulsion. Film resistivity was then measured as a function of silver volume fraction. Our results indicated that the addition of nano-sized silver colloids to micro-sized Ag flakes usually increased its resistivity, probably due to increased contact resistance. Only near the percolation threshold, would the addition of nano-sized silver particles decrease the resistivitv by helping to form the conductive path. Films made with only nano-sized silver colloids at the volume fraction of 0.848 showed a rather low resistivity of 1.93 x 10(-4) Omega cm. Increase in heating temperature helped to form necks between particles and thus improve the conductivity to some extent. (C) 2005 Published by Elsevier Ltd.
引用
收藏
页码:437 / 441
页数:5
相关论文
共 12 条
[1]   Synthesis of nanosized silver particles by chemical reduction method [J].
Chou, KS ;
Ren, CY .
MATERIALS CHEMISTRY AND PHYSICS, 2000, 64 (03) :241-246
[2]   Silver coating of spindle- and filament-type magnetic particles for conductive adhesive applications [J].
Dilsiz, N ;
Partch, R ;
Matijevic, E ;
Sancaktar, E .
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1997, 11 (08) :1105-1118
[3]   Conduction modelling of a conductive adhesive with bimodal distribution of conducting element [J].
Fu, Y ;
Liu, J ;
Willander, M .
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 1999, 19 (04) :281-286
[4]   Reliability of electrically conductive adhesive joints for surface mount applications: A summary of the state of the art [J].
Jagt, JC .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1998, 21 (02) :215-225
[5]   Effects of mixing procedures on the volume fraction of silver particles in conductive adhesives [J].
Lo, CT ;
Chou, KS ;
Chin, WK .
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2001, 15 (07) :783-792
[6]   A new and effective chemical reduction method for preparation of nanosized silver powder and colloid dispersion [J].
Nersisyan, HH ;
Lee, JH ;
Son, HT ;
Won, CW ;
Maeng, DY .
MATERIALS RESEARCH BULLETIN, 2003, 38 (06) :949-956
[7]   RESISTIVITIES OF CONDUCTIVE COMPOSITES [J].
RUSCHAU, GR ;
YOSHIKAWA, S ;
NEWNHAM, RE .
JOURNAL OF APPLIED PHYSICS, 1992, 72 (03) :953-959
[8]   Pressure-dependent conduction behavior of various particles for conductive adhesive applications [J].
Sancaktar, E ;
Dilsiz, N .
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1999, 13 (06) :679-693
[9]   Crystalline silver nanowires by soft solution processing [J].
Sun, YG ;
Gates, B ;
Mayers, B ;
Xia, YN .
NANO LETTERS, 2002, 2 (02) :165-168
[10]  
Webber ME, 1997, POLYM COMPOSITE, V18, P711