Squeeze-film air damping of thick hole-plate

被引:51
作者
Bao, MH [1 ]
Yang, H
Sun, YC
Wang, YL
机构
[1] Fudan Univ, Dept Micro Elect, State Key Labs ASIC & Syst, Shanghai 200433, Peoples R China
[2] Shanghai Inst Micro Syst & Informat Technol, State Key Labs Transducers, Shanghai 200050, Peoples R China
关键词
squeeze-film air damping; thick hole-plate; Reynolds' equation;
D O I
10.1016/S0924-4247(03)00263-2
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The damping effect of air flow in holes is considered based on Poiseuille equation and the damping effect of lateral flow is considered by conventional Reynolds' equation for infinite thick hole-plate. The expression for damping ratio is obtained and the conditions for minimum damping ratio can be found.-A modified Reynolds' equation is established for thick hole-plate with finite dimensions. The equation is a good approximation for hole-plates in typical MEMS devices. As it is also effective for non-hole-plate as well, it is more general than the conventional Reynolds' equation. The distribution of damping pressure under a hole-plate can be found by solving the modified Reynolds' equation with appropriate boundary conditions. As an example, the damping pressure of squeeze-film air damping of a long rectangular hole-plate is considered. Analytical expressions for the damping pressure, damping force and damping ratio are found. (C) 2003 Elsevier B.V. All rights reserved.
引用
收藏
页码:212 / 217
页数:6
相关论文
共 5 条
[1]  
Bao M.H, 2000, MICRO MECH TRANSDUCE
[2]   Micromechanical structures and microelectronics for acceleration sensing [J].
Davies, BR ;
Montague, S ;
Smith, JH ;
Lemkin, M .
MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY III, 1997, 3223 :237-244
[3]   MECHANICAL-THERMAL NOISE IN MICROMACHINED ACOUSTIC AND VIBRATION SENSORS [J].
GABRIELSON, TB .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1993, 40 (05) :903-909
[4]  
SADD MH, 1975, T ASME B, V97, P1366
[5]  
STARR JB, 1990, P IEEE SOL STAT SENS, P44