High heat flux heat pipe mechanism for cooling of electronics

被引：94

作者：

Zuo, ZJ ^{[1
]}

North, MT ^{[1
]}

Wert, KL ^{[1
]}

机构：

[1] Thermacore Int Inc, Ctr Technol, Lancaster, PA USA

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2001年 / 24卷 / 02期

基金：

美国国家科学基金会;

关键词：

high heat flux cooling; pulsating heat pipe; wick structure;

D O I：

10.1109/6144.926386

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper discusses an advanced heat pipe mechanism that has the potential of achieving heat flux capabilities over 250 W/cm(2). The mechanism utilizes thermally driven pulsating two-phase flow to achieve high heat flux capability and heat transfer coefficient. A simplified hydrodynamic model was developed to guide the proof-of-concept heat pipe design. A more detailed numerical model was also developed and will be solved to predict the heat pipe's thermal performance. Test results of proof-of-concept heat pipes verified the heat flux capability of the advanced mechanism and the accuracy of the simplified model. Pulsating heat pipes are feasible approaches to removing increasing heat dissipation densities in electronic equipment.

引用

页码：220 / 225

页数：6

共 17 条

[1]

Akachi H., 1990, Patent No. [4,921,041, 4921041, 4921041A]

[2]

AKACHI H, 1995, PULSATING HEAT PIPE

[3]

ANDERSON D, 1984, COMPUTATIONAL FLUID, P112

[4]

Chato J.C., 1962, ASHRAE J, V4, P52

[5]

FELDMAN KT, 1980, P AIAA 18 AER SCI M

[6]

KHRUSTALEV D, 1995, J HEAT TRANSF, V117

[7]

KHRUSTALEV D, 1996, INT J HEAT MASS TRAN, V39

[8] STABLE AND ACCURATE CONVECTIVE MODELING PROCEDURE BASED ON QUADRATIC UPSTREAM INTERPOLATION [J].

LEONARD, BP .

COMPUTER METHODS IN APPLIED MECHANICS AND ENGINEERING, 1979, 19 (01) :59-98

[9]

PLESCH D, 1991, MICROMECHANICAL DCS, V32

[10]

RAIFF R, 1973, INT J HEAT MASS TRAN, V16

← 1 2 →