Study of the thermal properties of polymeric dielectric materials by photothermal technique

In this paper, we present some results of the newly developed on-wafer photothermal measurement. To study thermal anisotropy, the out-of-plane thermal diffusivity measured from this technique is compared with the in-plane thermal diffusivity by measured by ISTS [1]. In addition to the thermal properties, the agreement with mechanical [2] and optical properties are also shown. The significance of different thermal performance between low K dielectric medium materials and SiO2 suggests that greater attention should be paid to thermal properties for integrated devices with low K materials.