Reactive flow of molten Pb(Sn) alloys in Si grooves coated with Cu film

被引:15
作者
Liu, CY [1 ]
Tu, KN [1 ]
机构
[1] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA
来源
PHYSICAL REVIEW E | 1998年 / 58卷 / 05期
关键词
D O I
10.1103/PhysRevE.58.6308
中图分类号
O35 [流体力学]; O53 [等离子体物理学];
学科分类号
070204 ; 080103 ; 080704 ;
摘要
We present an experimental study of the wetting behavior of Pb on flat and grooved Cu surfaces. The alloying of even 1-2 wt. % Sn into Pb can lead to dramatic changes in wetting angle and length flow into the grooves. The observed flow behavior disagrees with models based on the classical Washburn flow [E. W. Washburn, Phys. Rev. 17, 273 (1921)]. We conclude that the driving force of reactive wetting must take into account, besides the capillary force, the free energy change due to intermetallic compound formation. [S1063-651X(98)14311-8].
引用
收藏
页码:6308 / 6311
页数:4
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