A self-assembled monolayer-assisted surface microfabrication and release technique

被引:28
作者
Kim, BJ
Liebau, M
Huskens, J
Reinhoudt, DN
Brugger, J
机构
[1] Univ Twente, MESA Res Inst, Nanolink Strateg Res Orientat, NL-7500 AE Enschede, Netherlands
[2] Univ Twente, MESA Res Inst, Supramol Chem & Technol Grp, NL-7500 AE Enschede, Netherlands
关键词
self-assembled monolayer; dry release; demolding; photoplastic SU-8; MEMS/NEMS;
D O I
10.1016/S0167-9317(01)00469-5
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes a method of thin film and MEMS processing which uses self-assembled monolayers as ultra-thin organic surface coating to enable a simple removal of microfabricated devices off the surface without wet chemical etching. A 1.5-nm thick self-assembled monolayer of dodecyltrichlorosilane reduces the adhesion between the SiO2 substrate surface and a 100-nm thick evaporated aluminum film. A 100-mum thick layer of photoplastic SU-8, which is spun and structured by lithography and development on top of the monolayer/aluminum. sandwich layer, can be mechanically lifted off the surface with the aluminum layer. The organic monolayer provides enough stability for the microfabrication process including photoresist spinning and thermal steps. The aluminum film has a surface roughness of less than I mn rms as measured by AFM. Photolithographic microstructuring of the aluminum film prior to the photoplastic process allows for transparent embedded bottom-side metal electrodes. As first application example, molded nanoprobes for scanning near-field optical microscopy, has been demonstrated using this technique. (C) 2001 Elsevier Science BY All rights reserved.
引用
收藏
页码:755 / 760
页数:6
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