Electrodeposition of Cu from cyanoalkaline solutions in the presence of CPC and PEG -: An electrochemical and in situ SERS investigation

被引：27

作者：

Bozzini, B ^{[1
]}

D'Urzo, L ^{[1
]}

Mele, C ^{[1
]}

机构：

[1] Univ Lecce, INFM, Dipartimento Ingn Innovaz, I-73100 Lecce, Italy

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2005年 / 152卷 / 04期

关键词：

D O I：

10.1149/1.1869976

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The behavior of a cyanoalkaline copper plating system was studied with a special focus on the role of two organic additives, cetylpyridinium chloride (CPC) and poly(ethylene glycol) Mw 1500 (PEG). The influence of these additives on the adsorption behavior of the CN- ligands released during the Cu(I) complex reduction process has been investigated. Spectroelectrochemical results obtained by in situ Raman spectroscopy were complemented with cyclic voltammetric measurements. The potential-dependent surface-enhanced Raman spectroscopy spectra showed two prominent features at ca. 2090 and 2040 cm(-1), within the Raman shift range typical of C equivalent to N stretching v(CN-). Using a double- Gaussian model, a numerical elaboration of the two v(CN-) d bands was done, estimating the potential-dependent values of the (i) peak position, (ii) peak intensity, and (iii) full-width at half-maximum. Our results show (i) a chemical interaction of CPC with adsorbed CN-, weakening the Cu-CN- adsorption bond, (ii) an interaction of PEG with the Cu surface giving rise to cathode-blocking and alteration of the Cu growth mode. (c) 2005 The Electrochemical Society. All rights reserved.

引用

页码：C255 / C264

页数：10

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