A model of chemical mechanical polishing

被引：57

作者：

Paul, E ^{[1
]}

机构：

[1] Stockton State Coll, Pomona, NJ 08240 USA

[2] NIST, Gaithersburg, MD 20899 USA

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2001年 / 148卷 / 06期

关键词：

D O I：

10.1149/1.1372222

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

A model of chemical mechanical polishing is presented which quantitatively correlates the polishing rate with the slurry concentrations of both chemicals and abrasives. The model predicts that as the concentration of either chemicals or abrasives is increased, an initial steep rise in the polishing rate is followed by an asymptotic approach to a maximum rate. The causes and implications of this behavior are discussed. (C) 2001 The Electrochemical Society.

引用

收藏

页码：G355 / G358

页数：4

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