Heterogeneous recombination of atomic bromine and fluorine

被引:70
作者
Kota, GP [1 ]
Coburn, JW [1 ]
Graves, DB [1 ]
机构
[1] Univ Calif Berkeley, Dept Chem Engn, Berkeley, CA 94720 USA
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1999年 / 17卷 / 01期
关键词
D O I
10.1116/1.581582
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Recombination coefficients (gamma) of Br and F atoms have been measured for crystalline Si, quartz, photoresist, anodized aluminum, poly-Si, WSix, tungsten and stainless steel surfaces for a range of temperatures. The gamma(Br) and gamma(F) values are compared to our previously reported measurements of gamma(Cl) [G. P. Kota, J. W. Coburn, and D. B. Graves, J. Vac. Sci. Technol. A 16, 270 (1998)]. In general, the Br-, Cl- and F-atom recombination coefficients decrease as the surface temperature increases. The gamma(Br) values are similar to the gamma(Cl) values for the various surfaces. At room temperature, gamma(Br) is highest (> 0.4) for stainless steel and tungsten, moderate (0.1-0.4) for poly-Si, WSix and anodized Al, and lowest (< 0.05) for c-Si, quartz and photoresist. However, gamma(F), at room temperature, is no greater than 0.05 for all the surfaces. gamma(F) increases slightly as the temperature is decreased to 80 K but is still below 0.1 for all the surfaces. The recombination coefficient data as a function of temperature for all surfaces are fit to a phenomenological model developed previously for gamma(Cl) (see the above reference). The model assumes that the incident halogen atoms physisorb on a surface that is saturated with chemisorbed halogen atoms. The physisorbed atoms are assumed to diffuse on the surface and either desorb before recombining or recombine and then desorb. The recombination rate is assumed to be first order in physisorbed atom coverage. (C) 1999 American Vacuum Society. [S0734-2101(99)04701-6].
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页码:282 / 290
页数:9
相关论文
共 40 条
[1]   MOLECULAR-DYNAMICS SIMULATIONS OF DIRECT REACTIVE ION ETCHING OF SILICON BY FLUORINE AND CHLORINE [J].
BARONE, ME ;
GRAVES, DB .
JOURNAL OF APPLIED PHYSICS, 1995, 78 (11) :6604-6615
[2]   DETECTION OF IODINE ATOMS BY AN ATOMIC FLUORESCENCE TECHNIQUE - APPLICATION TO STUDY OF DIFFUSION AND WALL RECOMBINATION [J].
BREWER, L ;
TELLINGHUISEN, JB .
JOURNAL OF CHEMICAL PHYSICS, 1971, 54 (12) :5133-+
[3]  
Bukowski JD., 1996, THESIS U CALIFORNIA
[4]  
Chang J, UNPUB
[5]   Kinetic study of low energy argon ion-enhanced plasma etching of polysilicon with atomic/molecular chlorine [J].
Chang, JP ;
Arnold, JC ;
Zau, GCH ;
Shin, HS ;
Sawin, HH .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1997, 15 (04) :1853-1863
[6]   MOLECULAR-BEAM STUDY OF GAS-SURFACE CHEMISTRY IN THE ION-ASSISTED ETCHING OF SILICON WITH ATOMIC AND MOLECULAR-HYDROGEN AND CHLORINE [J].
CHUANG, MC ;
COBURN, JW .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1990, 8 (03) :1969-1976
[7]   ION-ASSISTED ETCHING OF SI WITH CL2 - THE EFFECT OF FLUX RATIO [J].
COBURN, JW .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1994, 12 (03) :1384-1389
[8]   THE ADSORPTION AND REACTION OF FLUORINE ON THE SI(100) SURFACE [J].
ENGSTROM, JR ;
NELSON, MM ;
ENGEL, T .
SURFACE SCIENCE, 1989, 215 (03) :437-500
[9]   THE REACTION OF FLUORINE-ATOMS WITH SILICON [J].
FLAMM, DL ;
DONNELLY, VM ;
MUCHA, JA .
JOURNAL OF APPLIED PHYSICS, 1981, 52 (05) :3633-3639
[10]  
FLAMM DL, 1989, PLASMA ETCHING, P115