Temperature distribution in advanced power electronics systems and the effect of phase change materials on temperature suppression during power pulses

被引：46

作者：

Evans, AG ^{[1
]}

He, MY

Hutchinson, JW

Shaw, M

机构：

[1] Princeton Univ, Mat Inst, Princeton, NJ 08540 USA

[2] Univ Calif Santa Barbara, Dept Mat, Santa Barbara, CA 93106 USA

[3] Harvard Univ, Div Engn & Appl Sci, Cambridge, MA 02138 USA

[4] Rockwell Int Corp, Thousand Oaks, CA 91360 USA

来源：

JOURNAL OF ELECTRONIC PACKAGING | 2001年 / 123卷 / 03期

关键词：

D O I：

10.1115/1.1370376

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A thermal analysis has been performed for a package design pertinent to power electronics. The objective has been the derivation of straightforward expressions that relate the materials used and their physical dimensions to the power input and the junction temperature. This has been done for both steady-state operating conditions and for pulses. The role of phase change materials (PCMs) in suppressing temperature elevations during pulses is also addressed.

引用

页码：211 / 217

页数：7

共 13 条

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*ASM INT, 1986, ASM EL MAT HDB, V1

[2] Thermal performance of a latent heat energy storage ventilated panel for electric load management [J].