Wire bonding over insulating substrates by electropolymerization of polypyrrole using a scanning micro-needle

被引：23

作者：

Shiratori, SS ^{[1
]}

Mori, S ^{[1
]}

Ikezaki, K ^{[1
]}

机构：

[1] Keio Univ, Dept Appl Phys & Physicoinformat, Kouhoku Ku, Yokohama, Kanagawa 223, Japan

来源：

SENSORS AND ACTUATORS B-CHEMICAL | 1998年 / 49卷 / 1-2期

关键词：

wire bonding; polypyrrole; micro-needle; electropolymerization;

D O I：

10.1016/S0925-4005(97)00338-9

中图分类号：

O65 [分析化学];

学科分类号：

070302 ; 081704 ;

摘要：

Electrically conducting wires 10-200 mu m in diameter were controllably formed over electrically insulating substrates by electropolymerization of a conducting polymer using a scanning micro-needle. The conductivity of the wire was estimated from the I-V characteristics to be about 0.5-200 S cm(-1) which is not inferior to the reported conductivity of an electrochemically polymerized polypyrrole (PPy) film. Wires were formed like bridges between two conducting electrodes over glass substrates. This technique can be used for wire bonding of elements or electrodes. (C) 1998 Elsevier Science S.A. All rights reserved.

引用

页码：30 / 33

页数：4

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