A broadband CPW-to-microstrip via-less transition for on wafer package probing applications

被引：6

作者：

Zhu, L ^{[1
]}

Melde, KL ^{[1
]}

Prince, JL ^{[1
]}

机构：

[1] Univ Arizona, Dept Elect & Comp Engn, Tucson, AZ 85721 USA

来源：

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2003年

关键词：

D O I：

10.1109/EPEP.2003.1250003

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

A broadband CPW to microstrip via-less transition is proposed and the optimal design is discussed. Simulation and measurement results are given. The results of the transition as multiline TRL calibration standards are presented.

引用

页码：75 / 78

页数：4