X-ray reflectivity of silicon on insulator wafers

被引:2
作者
Eymery, J
Rieutord, F
Fournel, F
Buttard, D
Moriceau, H
机构
[1] CEA Grenoble, Dept Rech Fondamentale Mat Condensee, F-38054 Grenoble 9, France
[2] CEA Grenoble, LETI, Dept Micro Technol, F-38054 Grenoble, France
关键词
X-ray reflectivity; silicon on insulator; interfaces;
D O I
10.1016/S1369-8001(00)00158-X
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The ability of X-ray reflectivity to analyse different silicon on insulator structures is underlined. The standard geometry with first reflection occurring at the surface gives information about the thickness, roughness, and density of the layers. Deeply buried interfaces, i.e. in between thick wafers, are analysed with a non-standard geometry (the first reflection occurs at the buried interface) and with a high-energy radiation. These two methods are, respectively, illustrated by the reflectivity measurements of (SiO2/Si/SiO2/bulk Si) and (bulk Si/thermal SiO2/native SiO2/bulk Si) bonded structures, and are explained in the framework of kinematic theory of X-ray reflectivity. (C) 2001 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:31 / 33
页数:3
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