Influence of moisture-uptake on mechanical properties of polymers used in microelectronics

被引：16

作者：

Buchhold, R ^{[1
]}

Nakladal, A ^{[1
]}

Gerlach, G ^{[1
]}

Sahre, K ^{[1
]}

Eichhorn, KJ ^{[1
]}

Herold, M ^{[1
]}

Gauglitz, G ^{[1
]}

机构：

[1] Dresden Univ Technol, Inst Solid State Elect, D-01062 Dresden, Germany

来源：

LOW-DIELECTRIC CONSTANT MATERIALS IV | 1998年 / 511卷

关键词：

D O I：

10.1557/PROC-511-359

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Polymers are currently considered as a possible alternative to silicon dioxide in the fabrication of interlevel dielectrics. To penetrate mainstream semiconductor device fabrication polymers have to meet a number of requirements regarding their long-term stability. One aspect is the mechanical stability of integrated polymer films under changing climatic conditions. In the present work, the impact of ambient moisture on the mechanical properties of thin polymer films (PI, BCB, and PFCB) was investigated. The sorption of water molecules in these materials typically causes an anisotropic volume expansion, resulting in increased mechanical film stress if the film is physically constrained by adjacent inorganic structures. Especially polyimides show both considerable moisture uptake and large changes in the mechanical film stress, while BCB and PFCB are virtually insensitive to ambient moisture. In the paper, experimental data (water uptake, in-plane swelling, out-of-plane swelling) are presented and discussed in detail.

引用

页码：359 / 364

页数：6